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Guangdong Zhengye Technology Co., Ltd. Industrial laser cutting / marking / drilling machine, X-Ray inspection machine , PCB manufacturing machine and consumables manufacturer / supplier in China.
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PCB Board UV Laser Cutting Machinery / CNC Cutting Machine With CE , RoHS

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PCB Board UV Laser Cutting Machinery / CNC Cutting Machine With CE , RoHS

Brand Name : Asida
Model Number : JG16
Certification : SGS, CE, RoHS, ISO 9001:2000
Place of Origin : CHINA
MOQ : 1Set
Price : Negotiation
Payment Terms : L/C, D/P, Western Union, MoneyGram, T/T, D/A
Supply Ability : 100 Sets/Year
Delivery Time : Negotiation
Packaging Details : Negotiation
System Processing Precision : ±25µm
Type for Cutting Machine : CNC Cutting Machine
Laser Power : 8W /30KHz
Laser Wavelength : 355 Nm
Weight : 2800Kg
Cutting Thickness : <1.0mm
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PCB Board UV Laser Cutting Machinery / CNC Cutting Machine With CE , RoHS

UV Laser Cutting Machine JG16 :

Laser SourceUV,355nm All-solid-state UV laser device, wavelength 355nm
Laser Power8W/30KHz
Laser Frequency30-120KHz
Maximum Processing Size500x400mm(Double working table)
Platform Maximum Operating Speed24m/min
Platform Maximum Positioning Accuracy±5µm

Platform Maximum Repeat Positioning Accuracy
System Processing Precision±25µm
Cutting Line Width20±5µm
Cutting Thickness<1.0mm
File formatGerber & .DXF & .lay,G(CAM)Standard G code(Can switch via CAM)
PowerAC220V 50Hz/2.5KW,AC380V 50Hz/5.5KW
Vacuuming Requirements516m³/h
Overall Dimensions1780x1680x1560mm
Environmental Temperature20±2°
Environmental Humidity<60%RH No dew
Ground Amplitude<5µm
Ground Pressure>1000kgf/m²
Industry-specific control machine with computer pre-installed drilling and cutting softwareMotion controller and industrial personal computer control mode
Equipped with 17"screen,300G hard disk


Drilling blind holes, vias in HDI board, blind cut and blind slot in rigid-flex board. Cutting a variety of FPC and cover layer, low carbonization. Cutting FPC and copper substrate thickness up to 1 mm, smooth appearance. Precisely etching of functional film. Cutting the base material.


1. Safe and reliable. Fully enclosed design, automatic control of worktable door to ensure safe operation;
2. Automation. Auto focus, auto-correction, auto-positioning, auto-homing, automatic spot compensation, and intelligent design;
3. Energy measuring. Automatically measure energy on the samples;
4. High drilling / cutting precision. Using ultra-high-precision scanning galvanometer, fully guaranteed drilling, cutting accuracy and quality;
5. Multi-panels cutting. With function to cutting array panels;
6. Optical optimization. High peak power and high pulse energy, fine focal spot, ensure cutting and drilling with high speed and high precision;
7. Convenient operation. Drilling and cutting with independent module, easy conversion;
8. Optimize design. Optimization of laser processing path function, reduce processing time and improve efficiency.

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