Depaneling Of Rigid And Flexible PCB Laser Cutting Equipment 10W
Precisive cutting of FPC and organic membrane covering board
without molds or the protection plate. High-energy laser source and
precise control of laser beams can improve the processing speed and
the accuracy of processing results. It has all the functions same
as the one produced by LPKF but price is lower.
1. Independent intellectual property rights of the control
software, Humanized interface, complete functions and simple
2. Processing any graphic, cutting different thickness and
different materials, stratified processing and complete
3. Adopt high-performance ultraviolet light laser with short wave
length, high beam quality and higher peak power properties. Because
ultraviolet light is through decomposition, vaporization instead of
melting to cutting the materials, so almost no burrs after
processing, small thermal effect, no stratification, precise
cutting effects, smooth, steep sidewall.
4. Fixed sample by using Vacuum mode, without matrix protection
plate, convenient and improving the processing efficiency.
5. Used for a variety of substrate materials cutting, such as:
Silicon, ceramics, glass, etc.
6. Automatic correction, automatic positioning and multi board
cutting function. Automatic board thickness measurement and
compensation. Full stroke motor compensation function. Improved
cutting accuracy, reduced horizontal vibration. Improved depth
cutting accuracy. Improved efficiency in cutting complex patterns.
|Laser Source||355nm All-solid-state UV laser cutting device,wavelength 355nm|
|Maximum Processing Size,||720mm×540 mm(21″×28″)|
|XY Platform Maximum Operating Speed||50m/min|
|System Processing Precision||±20µm|
|Galvanometer scanning range||50mm X 50mm|
|Overall Dimensions||1818mm×2317 mm×1550 mm|
|Humidity||<60%RH (No dew)|